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新闻资讯
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Polishing Particles for Semiconductors (CMP Slurry)

2021-09-15
Polishing Particles for Semiconductors (CMP Slurry)Cerium oxide slurry controlling particles size at a nano-levelCMP Slurry used in semiconductor polishing processes boast a high removal rate despi...
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What are CMP Slurries?

2021-09-15
The chemical mechanical planarization (CMP) process is used to planarize both die level and wafer level topography and also to remove overfill metal and metalloid materials that serve as interconne...
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Alumina Particles for Lapping

2021-09-15
ChuanJing Surface Conditioning's calcined aluminas are processed single platey crystals with tunable phase and physical properties. Our calcined aluminas are manufactured from high-quality calcined...
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What is the difference between Lapping, Grinding, & Polishing

2021-09-15
Lapping, grinding, and polishing are all finishing processes used in various manufacturing sectors to improve the surface finish, dimensional accuracy, or mechanical properties of a workpiece. Lapp...
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