Felt pads (non-woven)

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Felt-based Polishing Pad

Pads are chemical mechanical planarization (CMP) pads for stock, intermediate and final polish. They offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics.

Advantages

1.High removal rate

2. Low defectivity

3. Excellent flatness

Product
Thinkness(mm)Hardness(Asker C)
CJ4001.360
CJ6001.380
CJ8001.383
         CJ801              2.0               83
         CJ802              3.0               83