产品详情
Felt-based Polishing Pad
Pads are chemical mechanical planarization (CMP) pads for stock, intermediate and final polish. They offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics.
Advantages
1.High removal rate
2. Low defectivity
3. Excellent flatness
| Product | Thinkness(mm) | Hardness(Asker C) |
| CJ400 | 1.3 | 60 |
| CJ600 | 1.3 | 80 |
| CJ800 | 1.3 | 83 |
| CJ801 | 2.0 | 83 |
| CJ802 | 3.0 | 83 |