Diamond slurry type O is an oil based suspension designed for lapping and polishing of ceramic and metals. The specific carrier oil is suitable for high performance processing at high temperatures.
Water soluble ready-to-use diamond suspension designed for high performance lapping and polishing of sapphire, ceramics and metals. The suspension is suitable for use on metal lapping plates and on polishing pads. suspension is fully water soluble which simplifies handling and cleaning. Performance enhancers help to achieve highest material removal rates without compromising on surface finish. Process stability is increased due to the stabilized formulation which prevents precipitation of the diamond particle.
D50 Particle size | D50 Particle size |
20nm | 4.0μm |
50nm | 5.0μm |
80nm | 6.0μm |
100nm | 7.0μm |
0.2 μm | 8.0μm |
0.5 μm | 9.0μm |
0.8 μm | 10μm |
1.0μm | 12μm |
1.5μm | 15μm |
2.0μm | 20μm |
3.0μm | 25μm |